3D01200 - SEMI 3D12 - Guide for Measuring Flatness and Shape of Low Stiffness Wafers StdTpc-300 mm Packaging org in March 2006

org in March 2006

Flat Panel Display – Factory Automation Global Technical Committeeで技術的に承認されている。現版は2009年5月13日，global Audits and Reviews Subcommitteeにて発行が承認された。2009年6月にwww

本仕様は，0

previously published in 1996

orgで入手可能となる。2011年11月発行に至る。初版は1995年発行。

3D01200 - SEMI 3D12 - Guide for Measuring Flatness and Shape of Low Stiffness Wafers StdTpc-300 mm Packaging org in March 20061 Purpose 1. 1 The control of parameters, such as thickness, total thickness variation (TTV), bow, warp, and flatness, is well known to be essential to many, if not all, semiconductor processes as reflected in a number of existing standards. 1. 2 The general trend in wafer geometry is to a larger diameter but even so the thickness increases correspondingly, it may not be enough to sustain adequate stiffness of the wafer. With growing aspect ratio of a